In today's digital age, electronic products have penetrated into every corner of our lives, from smartphones, computers to various household appliances and industrial equipment, and their normal operation is inseparable from small components. However, these components may have various failures in complex use environments and long-term working conditions, thus affecting the performance and safety of the entire electronic product.

In the case of electronic component failure, failure caused by high temperature is particularly obvious. Now, let's discuss why electronic components are prone to failure in long-term use in high temperature environments, and what problems of high temperature protection can Parylene material solve with its unique properties?

The core reasons for component failure caused by high temperature

1. Thermal aging of materials

l Degradation of insulating materials: The molecular chains of packaging materials such as epoxy resin and silicone break at high temperatures, resulting in decreased mechanical strength, cracking, and loss of protection capabilities (for example, for every 10°C increase in temperature, the life of epoxy resin is shortened by about 50%).

l Accelerated metal migration: Metals in solder joints and wires (such as tin and copper) undergo electromigration and creep at high temperatures, resulting in short circuits or open circuits (at 150°C, the creep rate of solder joints can be increased by 10 times).

2. Thermal stress mismatch

l CTE (coefficient of thermal expansion) differences: Different materials (such as silicon chips and ceramic substrates) expand differently when heated, generating mechanical stress, resulting in interface delamination or cracks (typical CTE differences: silicon (2.6 ppm/°C) vs copper (17 ppm/°C)).

3. Intensified chemical corrosion

l Oxidation and ion contamination: High temperature accelerates the reaction of oxygen, moisture and metal (such as copper oxidation to generate CuO), and promotes ion migration (such as Cl⁻ corroding aluminum wire).

l Release of volatile organic matter: Plastic packaging materials release low molecular weight organic matter at high temperature, which pollutes sensitive components (for example: the concentration of organic matter released by BGA packaging at 125°C can reach 5 times that of room temperature).

4. Deterioration of semiconductor performance

l Enhanced carrier scattering: High temperature causes the semiconductor lattice vibration to intensify, the carrier mobility to decrease (silicon mobility decreases by about 30% at 150°C), and the device efficiency to decrease.

l Leakage current doubling: The reverse leakage current of the PN junction increases exponentially with temperature (the leakage current doubles for every 10°C increase), causing a surge in power consumption and thermal runaway.

High temperature protection mechanism of Parylene material

Parylene is an ultra-thin polymer coating (typical thickness 1-50 microns) formed by chemical vapor deposition (CVD). Its high temperature protection mechanism includes:

1. High temperature stability advantage

l Temperature resistance level comparison:

2.Thermal stress buffering effect

l Low modulus flexible coating: The elastic modulus of Parylene film (typical thickness 1-50μm) (Parylene C is about 3.2 GPa) is much lower than that of rigid packaging materials, which can absorb the stress caused by CTE mismatch and reduce microcracks (experiments show that the coating can extend the fatigue life of solder joints by 3 times).

3. Chemical protection enhancement

l Passivation of surface defects: Through vapor deposition (CVD), a pinhole-free film is formed to completely cover the micropores and scratches on the surface of components, blocking oxygen and moisture penetration (water vapor transmission rate <0.1 g·mm/m²·day).

l Chemical corrosion resistance: Parylene AF4 has extremely high tolerance to acids, alkalis and solvents (can resist 48 hours of corrosion by concentrated sulfuric acid), protecting metal circuits.

4. Electrical performance guarantee

l High temperature insulation maintenance: At 200°C, the dielectric strength of Parylene F still remains >5000 V/mm (7000 V/mm at room temperature), avoiding high temperature leakage.

l Suppress arc discharge: Uniform film coverage can eliminate local electric field concentration and reduce the risk of arcing at high temperatures (experiments show that coating can increase arcing voltage by 40%).

Comparison of typical application scenarios

Through the above mechanism, Parylene material significantly extends the life of electronic components in high temperature environments, becoming the preferred solution for precision electronic protection.

Key indicators for selecting a Parylene supplier

If high temperature protection is required, customers are advised to focus on:

1. Material certification: UL 94 V-0 flame retardant rating, ISO 10993 biocompatibility (medical scenarios).

2. Process control: coating thickness uniformity (within ±5%), deposition temperature (to avoid damage to heat-sensitive components).

3. Customization capability: whether fluorescent marking (for quality inspection) or composite coating (such as Parylene+Al₂O₃ to enhance heat dissipation) can be provided.

By selecting the type of Parylene and process parameters in a targeted manner, the reliability and life of components in high temperature environments can be significantly improved

5. Advantages of choosing FCDTECH(Fangcunda) Parylene

1. Full range of products & cutting-edge technology in the industry

l Full range of powder materials: AF4, F, D, C, N and halogen-free, fluorescent powder to meet diverse needs.

l Purity advantage: For example, the purity of Parylene F is >99.0%, the film is denser, the product is more uniform and has better fluidity, and under the same protection effect, less powder material is used, which directly reduces your material cost.

2. Compliance qualification & reliability guarantee

l Legal qualification: A factory with a legal production license for Parylene dimer, in compliance with ISO 9001.

ll Medical grade certification: Passed the US biocompatibility test (USP Class VI), and has served many global medical device companies.

3. Full industry chain support

l Independent and controllable from R&D to delivery: Own factory + technical team to ensure rapid response to customized needs (such as fluorescent labeling, special film efficiency optimization, etc.).

l Cost advantage: Large-scale production + localized service, compared with imported products, the price is reduced by more than 50%, and the delivery time is shortened by more than 50%.

If you need specific test data or case references, FCDTECH(Fangcunda) can provide further technical documentation.